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Vienna University of Technology
Institute of Electrodynamics, Microwave and Circuit Engineering

 Contact data
StreetGusshausstrasse 25/354 
ZIP, City, Region 1040 - Vienna (Vienna) 
Phone+43-1-58801-354 31 
Fax+43-1-58801-354 99 
EmailSend Email
 Contact person

DI Dr. Kerstin Schneider-Hornstein (Univ. Ass.)
 Employees (Total)
Total: 11-50  number of researches: 14

 Central aim of organisation
The central aim of EMCE is the design of highly integrated systems-on-a-chip, which can be either analog/digital or optoelectronic/analog circuits.

 Briefly describe your organisation
The main research areas of the circuit engineering group (Prof. Dr. H. Zimmermann) at the Institute of Electrodynamics, Microwave and Circuit Engineering of Vienna University of Technology are design and characterization of analog and optoelectronic integrated circuits (OEICs) in cooperation with industry. One focus lies on OEICs for optical storage systems and datacomm receivers with integrated photodiodes for glass and plastic fibers. The main goals of all optical receivers are high data rate and high sensitivity: -30dBm at 1Gb/s and -24dBm at 3Gb/s, respectively, were obtained. New activities are optical sensors for distance measurements and 3D camera, which were published recently at the most important international conferences of the research area (IEEE ISSCC and ESSCIRC).
The second focus is the development of analog integrated circuits like operational amplifiers e.g. with 128dB DC gain and 700MHz transit frequency, low power comparators working at 7GHz in 65nm CMOS, as well as mixers and filters also in 65nm CMOS technology.

 Core Competency

Research & Development

 ICT sectors:
   - Network and Broadband Technologies     
   - Sensor Technology     
   - Systems-on-Chip, Systems-on-Package     
   - Integrated Circuits     
   - Electronic circuits, components and equipment     

 ICT keywords
Optoelectronic Integrated Circuits, Deep-sub-µm CMOS Circuits, Nanometer CMOS Design, 3D-Camera
 RTD Experiences & Publications

 My organisation has been involved in projects funded by the following EU-programmes
  Coordinator  Partner 
EU Framework Programme (FP)
Other international co-operative research

 Austrian Research and Development Projects
  Coordinator  Partner 
Cooperative Projects

 RTD Experience
At the EMCE specific infrastructure for simulations as well as characterization of integrated circuits is available. All designed ASICs are also characterized in-house.

In the following an overview over the available special infrastructure is given:

For design and simulation:
Design framework: Cadence
Device simulation: advanced TCAD package for 2D and 3D simulations

For possible projects not only the actual infrastructure, but also the close support connections to main European chip manufacturers as well as ASIC foundries and the access to many years of knowhow and experience in design of different optical receivers and analog circuits treasured by the circuit engineering workgroup are important.

For the characterization of photosensitive devices:
On-Wafer characterisition on a semiautomatic waferprober for serial measurements
Optical measurement sources in several wavelengths from infrared to blue
Probecard system for flexible contacting

For the characterization of optical fibre receivers:
On-wafer and connectorized (on PCB)
Bitpattern analyzer up to 40 GBit/s
Fast modulated laser sources (infrared to blue)

The workgroup which has many years of experience in optical measurement setups for the characterization is also a very important factor for successful realization of new projects.

For the characterization of optical distance measurement sensors:
Mechanical measuring bar, 3m long
Optical power meter
Mixed-signal oscilloscope

Additional equipment:
Waferbonder (for mounting of microchips)
PCB manufacturing in house
Optical benches and optical components
Climate controlled environments and temperature controlled cabinets
Digital sampling oscilloscope (60GHz)
Single-shot oscilloscope (40GS/s)
Network und spectrum analyzers (3 GHz + 20GHz each)
Bitpattern generator (2.5Gb/s + 10Gb/s + 40Gb/s)
Bitpattern receiver (10Gb/s + 40Gb/s)
Multilevel generator
Optical power meter
Logic analyzer

• H. Zimmermann, Integrated Silicon Optoelectronics, Springer, Berlin, Heidelberg, 2000.
• H. Zimmermann, Silicon Optoelectronic Integrated Circuits, Springer, Berlin, Heidelberg, 2003.
• K. Schneider, H. Zimmermann, Highly Sensitive Optical Receivers, Springer, Berlin, 2006.
• D. Micusik, H. Zimmermann, ‘130dB-DR Transimpedance Amplifier with Monotonic Logarithmic Compression and High-Current Monitor‘, IEEE Int. Solid-State Circuit Conference (ISSCC ’08), Digest of Technical Papers, Vol. 51 (2008), pp. 78 - 79.
• R. Swoboda, H. Zimmermann, ‘11Gb/s Monolithically Integrated Silicon Optical Receiver for 850nm Wavelength’, IEEE Int. Solid-State Circuits Conference (ISSCC), Digest of Technical Papers, Vol. 49, 2006, pp. 240-241.
• R. Swoboda, H. Zimmermann, ‘A 2.5Gbps Silicon Receiver OEIC with Large Diameter Photodiode’, Electronics Letters, Vol. 40, (2004), pp. 505 - 507.
• R. Swoboda, H. Zimmermann, ‘A 2.5Gbps Receiver OEIC in 0.6µm BiCMOS Technology’, IEEE Photonics Technology Letters, Vol. 16, July 2004, pp. 1730 - 1732.
• K. Schneider, H. Zimmermann, A. Wiesbauer, ‘Optical Receiver in deep-sub-µm CMOS with -28.2dBm sensitivity at 1.25Gbit/s’, Electronics Letters, Vol. 40, No. 4 (2004), pp. 262 – 263.
• C. Seidl, H. Zimmermann, ‘Single-Stage 378MHz 178kW Transimpedance Amplifier with Capacitive Coupled Voltage Divider‘, IEEE ISSCC 2004, pp. 470 – 471, 540.
• R. Swoboda, J. Knorr, H. Zimmermann, ‘A 5-Gb/s OEIC With Voltage-Up-Converter’, IEEE Journal of Solid-State Circuits, Vol. 40, No. 7, July 2005, pp. 1512-1526
• A. Nemecek, K. Oberhauser, H. Zimmermann, ‘Distance Measurement Sensor With PIN-Photodiode and Bridge Circuit’, IEEE Sensors Journal. vol. 6, no. 2, pp. 391-397, 2006
• G. Zach, H. Zimmermann: A 2x32 Range-Finding Sensor Array with Pixel-Inherent Suppression of Ambient Light up to 120klx; Vortrag: IEEE International Solid-State Circuit Conference, San Francisco; 08.02.2009 - 12.02.2009; in: 2009 Digest of Technical Papers, (2009), pp. 352 - 354.
• M. Atef, R. Swoboda, H. Zimmermann: Optical receiver front-end for multilevel signalling; Electronics Letters, vol. 45 (2009), pp. 121 - 122.
• B. Goll, H. Zimmermann: A 65nm CMOS Comparator with Modified Latch to Achieve 7GHz/1.3mW at 1.2V and 700MHz/47μW at 0.6V; Vortrag: IEEE International Solid-State Circuit Conference, San Francisco, CA, USA; 08.02.2009 - 12.02.2009; in: 2009 Digest of Technical Papers ISSCC, vol. 52 (2009), pp. 328 - 330.
• R. Kolm, H. Zimmermann: 3rd-Order Current-Input/Output Filter with Virtual Ground in 65nm CMOS; Vortrag: Austrochip, Graz, Österreich; 11.10.2007; in: 15th Austrian Workshop on Microelectronics, Proceedings, (2007), ISBN: 978-3-902465-87-0; S. 35 - 38.
• R. Swoboda, M. Förtsch, H. Zimmermann: 3Gbps-per-Channel Highly-Parallel Silicon Receiver OEIC; Vortrag: European Conference and Exhibition on Optical Communication, ECOC, Berlin, Deutschland; 16.09.2007 - 20.09.2007; in: 33rd european conference and Exhibiton on Optical Communication, Proceedings Volume 2, (2007), S. 255 - 256.
• R. Kolm, H. Zimmermann:A 3rd-Order 235MHz Low-Pass gmC-Filter in 120nm CMOS; Vortrag: European Solid-State Circuits Conference (ESSCIRC), Montreux, Switzerland; 19.09.2006 - 21.09.2006; in: Proceedings of the 32nd European Solid-State Circuits Conference, (2006), pp. 215 - 218.
• K. Schweiger, H. Uhrmann, H. Zimmermann: Low-Voltage Low-Power Double Bulk Mixer for Direct Conversion Receiver in 65nm CMOS; in: 2009 IEEE Design and Diagnostics of Electronic Circuits and Systems, (2009), pp. 74 - 77.

 Inserted / Updated
2004-12-01 / 2009-10-20